诚邀您共赴第27届电子封装技术国际展会

过去30多年，ICEPT已发展成为电子封装领域最具影响力和最高水平的学术与产业盛会之一。会议始终致力于促进电子封装材料、工艺、设备、设计、可靠性等多学科的交流与合作，搭建起学术界与产业界互动、创新、共赢的国际化平台。

每年，电子封装技术国际会议吸引大批国内外高校、研究机构、电子封装产业相关厂商、以及来自近20个国家和地区，超过800位知名专家、学者和企业界人士踊跃参与。本届会议将继续秉承“创新发展、交流合作”的宗旨，邀请全球知名专家学者和企业界精英，共同探讨电子封装技术最新进展、未来趋势及产业应用。

Over the past 30-plus years, ICEPT has evolved into one of the most influential and top-tier academic and industrial events in the field of electronic packaging. Committed to advancing interdisciplinary exchanges and collaboration covering electronic packaging materials, processes, equipment, design, reliability and other areas, the conference has built an international platform for interaction, innovation and win-win cooperation between academia and industry.

Each year, the International Conference on Electronic Packaging Technology draws extensive participation from universities, research institutes and electronic packaging manufacturers worldwide, alongside more than 800 renowned experts, scholars and industry professionals from nearly 20 countries and regions. Upholding its mission of "Innovation-driven Development, Exchange and Collaboration", this year’s conference will invite distinguished global scholars and industry leaders to jointly discuss the latest advances, future trends and key industrial applications electronic packaging technologies.

Finetech德芯科旗下7款产品将由我们的团队为您逐一讲解。

Our team will walk you through all seven products under Finetech one by one.

Finetech德芯科，期待与您西安相聚，共话高端精密智造装备产业发展，共创半导体高端智造事业新辉煌！

Finetech looks forward to meeting you in Xi’an to jointly explore the industrial development of high-end precision intelligent manufacturing equipment and forge new glories in high-end semiconductor intelligent manufacturing!

展会时间Time：2026年8月5日—8月7日

展会地点Position：陕西西安豪享来温德姆至尊酒店(大唐不夜城大雁塔店)

展位信息Number：C18